synthetic crystalline wafer substrate 온라인 제조

Product model TO-8X Product name 4J29 Alloy Package With 42 Alloy Cover Flat Plug-In Product formation Material Quantity 1. bottom 4J29 1 2. lead 4J29 5 3. T shaped lead 4J29 1 4. glass insulator DM-305 5 5. cap 4J29 1 FINISH Shell and pins are plated Ni:4~11.43um and Au≥1um;Cap is plated Ni:1.3~11... 자세히보기

Product name: infrared detector package Applications: infrared detectors Product features: The infrared detector package can provide high-reliability and airtight packaging for refrigerated and uncooled infrared detectors. The main package forms are butterfly ceramic package, ceramic PGA package and ... 자세히보기

Specifications: Material: --------------------------------------------------------- Sapphire Diameter Tolerance: ------------------------------------------ +0.0, -0.1mm Thickness Tolerance: ---------------------------------------- ±0.1mm Clear Aperture: ----------------------------------------------... 자세히보기

Material: BK7 Dimension Tolerance: +0.0, -0.1mm Thickness Tolerance: ± 0.1mm Surface quality: 60/40(Standard), 10/5(High Precision) Clear Aperture: >85% Flatness: λ(Standard), λ/10(High Precision) per 25mm@633nm Parallelism: 1' (Standard), 10" (High Precision) Bevel: 자세히보기

Product name: Robust Iron-Nickel-Cobalt Flatpack With Unusual Lead Forming Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating coating: Package,pin,lid are plated Ni:1.3~11.43um;Package and pins are plated Au≥1.0um Product formation: Material Quantity 1. Cover plate 4J42... 자세히보기

Product Name Well Suited Metal Package Flat Bottom Package With 1.5mm Depth In Top Seal Plating Coating Fully Plating Au or Selective Plating Au Finish Header and cap is plated Ni:3~11.43um and header is plated Au ≥1.0um and pins are plated Au≥1.3um Product Information Material Quantity 1. Base ... 자세히보기

Product Name Plug-in Platform Metal Package Plating Coating Fully Plating Au or Selective Plating Au Finish Header and cap is plated Ni:3~11.43um and header is plated Au ≥1.0um and pins are plated Au≥1.3um Product Information Material Quantity 1. Base Kovar 1 2. Brazing ring HlAgCu28 1 3. Glass ... 자세히보기

Technical characteristics: Product: Micro channel heat sink Size: 27.00 x 10.80 x 1.50 mm Flatness of chip mounting area: ≤ 2 um Roughness of chip mounting area: ≤ 0.3 um Plating thickness: Ni (2-5um) Au (0.05-0.15um) Water flow: ≥ 300ml/min High thermal conductivity aluminum nitride ceramic heat ... 자세히보기